|
|
Environmental
DLP systems have passed a series of environmental and regulatory tests to simulate thermal shock, temperature cycling, mechanical shock, vibration, moisture resistance, and acceleration conditions.
The TI DMD™ and the Environment Most reliability concerns are focused on the hinges that tilt the mirrors from one position to another. To test reliability, DMDs were subjected to accelerated life cycle tests simulating approximately 20 years of use. Inspection of the devices after the testing showed no broken hinges on any of the devices. Texas Instruments has completed thousands of hours of life cycle and environmental testing to conclude that the DMD and DLP systems are inherently reliable. Combat Displays display system has passed the military environmental tests with no adverse affects to the DMD and supporting DLP chip set.
| Environmental TestingCombat Displays systems meet the most demanding cockpit and environmental requirements, performing reliably in adverse conditions while displaying vital information to the user that can make the difference between mission success and failure. Combat Displays system has been tested to and passed the following:
Thermal Analysis, IAW MIL-STD –810, Methods 501 and 502
Humidity, IAW MIL-STD-810F, Method 507.4
Vibration, MIL-STD-167-1
Shock, MIL-S-901D
Radiated Emissions, MIL-STD-461E, Requirement RE102
Conducted Emissions, MIL-STD-461E, Requirement CE102Depending upon the requirements, Combat Displays’ systems testing may include the following:| Lighting | | | | MIL_STD-3009 | | LIGHTING, AIRCRAFT, INTERIOR, NIGHT VISION IMAGING SYSTEM (NVIS) COMPATIBLE | | MIL-L-85762A | | LIGHTING, AIRCRAFT, INTERIOR, NIGHT VISION IMAGING SYSTEM (NVIS) COMPATIBLE | | Environmental | | | | MIL-STD-810G | 507.4 | HUMIDITY | | MIL-STD-810G | 509.4 | SALT/FOG | | MIL-STD-810G | 510.4 | SAND/DUST | | MIL-STD-810G | 500.4 | LOW PRESSURE(ALTITUDE) PROCEDURE II | | MIL-STD-810G | 501.4 | HIGH TEMPERATURE PROCEDURE I | | MIL-STD-810G | 501.4 | HIGH TEMPERATURE PROCEDURE II | | MIL-STD-810G | 502.4 | LOW TEMPERATURE PROCEDURE II | | MIL-STD-810G | 514.5 | VIBRATION | | MIL-STD-810G | 516.5 | MECHANICAL SHOCK, PROCEDURE I | | MIL-STD-810G | 513.5 | ACCELERATION PROCEDURE II | | MIL-STD-810G | 516.5 | MECHANICAL SHOCK, PROCEDURE V | | MIL-STD-810G | 513.5 | ACCELERATION PROCEDURE III | | MIL-STD 810G | 519.4 | GUNFIRE VIBRATION | | MIL-STD-810G | 511.4 | EXPLOSIVE ATMOSPHERE | | MIL-STD-810G | 501.2 | OPERATING HIGH TEMPERATURE (+50 DEGREES C) | | MIL-STD-810G | 502.2 | OPERATING LOW TEMPERATURE (0 DEGREES C) | | MIL-STD-810G | 507.2 | HUMIDITY (OPERATING) - UP TO 95%, NON-CONDENSING | | MIL-STD-810G | 507.2 | HUMIDITY (NON-OPERATING) - UP TO 95%, NON-CONDENSING | | MIL-STD-108E | | DRIP TEST | | MIL-STD-810G | 514.3 | VIBRATION | | MIL-STD-810G | 516.3 | OPERATING SHOCK | | MIL-STD-810G | 516.3 | BENCH SHOCK | | MIL-STD-901D | | SHOCK, GRADE A, CLASS II, TYPE A | | MDC A4241 Rev B | | TEMPERATURE AND ALTITUDE | | MDC A3376 ADD II | | VIBRATION | | MDD A3376 ADD II | | SHOCK | | MIL-STD-810F | 507.4 | HUMIDITY | | MIL-STD-810F | 511.4 | EXPLOSIVE ATMOSPHERE | | MIL-STD-810F | 500.4 | EXPLOSIVE DECOMPRESSION | | MIL-STD-810F | 510.4 | BLOWING DUST | | MIL-STD-810F | 509.4 | SALT SPRAY |
| E M I | | | | MIL-STD 461E,F | CE 102 | CONDUCTED EMISSIONS, POWER LEADS | | MIL-STD 461E,F | CS 10 | CONDUCTED SUSCEPTIBILITY, POWER LEADS | | MIL-STD 461E,F | CS 114 | CONDUCTED SUSCEPTIBILITY, BULK CABLE INJECTION | | MIL-STD 461E,F | CS 115 | CONDUCTED SUSCEPTIBILITY, BULK CABLE INJECTION | | MIL-STD 461E,F | CS 116 | CONDUCTED SUSCEPTIBILITY, DAMPED SINUSOIDAL TRANSIENTS | | MIL-STD 461E,F | CS 117 | OFF MODE TESTING | | MIL-STD 461E,F | RE 102 | RADIATED EMISSIONS | | MIL-STD 461E,F | RS 103 | RADIATED SUSCEPTIBILITY | Highly Accelerated Life Cycle Testing Flight Testing |
|